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News & Highlights
- Ericsson and STMicroelectronics to Create World Leader in Semiconductors and Platforms for Mobile Applications
- STMicroelectronics Demonstrates First Physical Layer IP For 6Gb/s SATA Hard Disk Drives at IDF
- STMicroelectronics, STATS ChipPAC and Infineon to Set New Milestone in Establishing Wafer-Level-Packaging Industry Standard
- STMicroelectronics to Sponsor European Microelectronics and Packaging Conference & Exhibition 2009
- STMicroelectronics Improves System Clock Distribution with Low-Power ICs Supporting Per-Channel Enable Controls

