News & Updates from STMicroelectronics
April 2009

 

 
PRODUCT NEWS

STMicroelectronics unveils extremely small packages for its STM32 32-bit ARM Cortex MCU family

A growing number of applications have size constraints, notably for portable or tiny module applications. Die assembly is an option for some, but requires specific know-how and handling. To help designers overcome PCB size constraints, ST brings two new and simpler package options for its award winning STM32 microcontrollers. The TFBGA 64 features 8 x 8 balls with 0.5 mm pitch in only 5 mm x 5 mm and is available for all Performance line products (STM32F103) ranging from 16 Kbytes to 128 Kbytes of Flash. The WLCSP (wafer-level chip-scale package) features 8 x 8 balls with 0.5 mm pitch in only 4.5 mm x 4.5 mm and is available for all Performance line products ranging from 256 Kbytes to 512 Kbytes of Flash. Both are as simple to use as regular BGA packages, with a dimension that allows the most compact integrations. More


New innovative family of 30V MOSFETs to deliver industry-leading efficiency while reducing the requirements for passive components

To meet market demand for more power per cubic inch in the latest DC-DC converters, ST’s newest proprietary STripFET VI DeepGATE technology achieves the industry’s best RDS(on) x active area, which is almost 20% better than the previous generation. The first available devices based on this technology are the STD150N3LLH6 and STD95N3LLH6, both in DPAK packages with 2.4 mΩ @ 10 V and 3.7 mΩ @ 10 V respectively. The same silicon is assembled in SO-8 and PowerFLAT 5x6 packages, where a lower RDS(on) is achieved by using a copper clip bonding. More


ST reinforces its leading EEPROM position in medical applications with extra low power consumption, high-density devices

ST's EEPROMs boost innovation in the medical segment with a complete family of devices featuring space saving (WLCSP, VFN 2 x 3 packages and wafer form) at high density (1-Mbyte, 521-Kbyte and 256-Kbyte memories). These EEPROMs are ideal for compact medical applications such as hearing aids or blood pressure analysis. The tiny memory chips are available in M24 (I²C bus) and M95 (SPI bus) versions, and operate over a wide 1.8 to 5.5 V voltage range. The devices are specified for more than 1M write cycles with over 40 years data retention, while requiring less than 5 mA during write. More


HDMIULC6-4F3/HDMI05-CL02F3: ESD protection and control-line termination for HDMI interfaces

The high-definition multimedia interface (HDMI) is a compact audio/video connector interface for transmitting uncompressed digital streams. It represents a digital alternative to consumer analog standards such as radio frequency (RF) coaxial cables, composite video, S-Video, SCART, component video, D-Terminal, and VGA. HDMI encodes the video data into the TMDS link for digital transmission over the HDMI connector. More


STMicroelectronics launches single-chip set-top box ICs for sharper competitive edge in cable and satellite

The STi5197 (cable) and STi5189 (satellite) are single-chip STB ICs that share a common architecture for MPEG-2 audio/video-decoding and application-processing functions. The chips enable fast time-to-market for products such as basic zappers, and interactive and DVR-capable STBs. The STi5197 supports DVB-C including ITU-T J83 Annexes A/B/C, and TSMF. The STi5189 supports DVB-S for satellite. All industry-standard middleware and browsers are also supported. Both ICs support all major conditional-access security schemes, with integrated DVB, DES, Multi2 and ICAM descramblers, as well as a built-in smartcard interface. Additional features include an interface to off-chip Flash memory, enabling support for a PVR-type time-shift feature without requiring a hard disk drive. The USB interface is ideal for general connectivity including implementing DVR-enabled STBs. An Ethernet interface is also integrated enabling manufacturers to build hybrid STBs on the same platform. An integrated audio subsystem provides digital and analog outputs and supports MP3 and Dolby Digital 5.1 decoding. Both devices are available in a choice of 23 x 23 mm plastic BGA (PBGA) or cost-optimized 15 x 15 mm low-profile fine-pitch BGA (LFBGA) packages. More


STMicroelectronics announces full CMSIS compliance of STM32 software library

The Cortex Microcontroller Software Interface Standard (CMSIS) is a new standard that was defined by ST, ARM and various silicon and software vendors to provide a common approach to interface with peripherals, real-time operating systems and middleware components for ARM Cortex based microcontrollers, in order to foster innovation in software and simplify microcontroller programming. The latest revision of ST's STM32 firmware libraries is now completely CMSIS compliant. ST is working with ARM and other partners on improving and extending the CMSIS standard. More



TRAINING / EVENTS

Online video demonstrates 3-axis, low-power MEMS accelerometer

This 4 minute video clip shows the use and exceptional power management capabilities of the LIS300 family of MEMS sensors. Available in 6-, 8- or 12-bit resolutions, these 3-axis accelerometers share the same 3 x 3 mm LGA package and pinout. In standby mode, the accelerometer consumes only 8 μA, while it is ready to immediately revert to normal mode as soon as motion is sensed. More


See STMicroelectronics at PCIM Europe 2009 in Nuremberg

STMicroelectronics, the worldwide #1 in Power Conversion, will present its latest solutions and products for High Efficiency Power Management, Motion Control, Lighting and Automotive. On display will be several efficient solutions for lighting (LED + CFL), using the latest members of the VIPer™ family and the new high voltage MDmesh V™ MOSFETs with the lowest RDSon worldwide. Another highlight is on Motion Control and Sensor solutions including High Temperature Triacs, new family of Gate drivers, STM8S/STM32 motor control hardware and firmware, MEMS gyroscopes and touch sensing. The overall message emphasizes ST's longterm commitment to develop products for most efficient systems in order to lower the worldwide power consumption. More



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