News & Updates from STMicroelectronics
October 2009

New 32-bit microcontroller with embedded 2.4 GHz radio for wireless monitoring

The STM32W family combines performance, code-density and integration advantages with best-in-class IEEE 802.15.4 radio to deliver a true system-on-chip platform supporting embedded wireless sensor network design. This new device implements the IEEE 802.15.4 physical (PHY) layer as well as the media access control (MAC) layer, giving developers the flexibility to target ZigBee-compliant specifications or to build any network wireless protocol which interfaces with the standardized IEEE 802.15.4 MAC. More

High-accuracy accelerometer enables vehicle movement-based features

The AIS226DS two-axis accelerometer senses acceleration up to ±6g and can resolve minute angles of incline, smaller than 0.02 degrees. Being highly stable over the whole automotive temperature range, this sensor enables several in-vehicle applications, such as self-adjusting features, advanced safety and security systems, and enhanced GPS. The AIS226DS, assembled in a sturdy SO16W full-molded package, is qualified to the AEC-Q100 automotive quality standard. More

BAL-2593D5U: 50/50+j50 balun transformer for 2.45 GHz ISM band

The BAL-2593D5U is a balun designed to transform a single-ended signal to differential signals in Bluetooth applications. With less than 1.2 dB insertion losses in the 2400 MHz to 2500 MHz bandwidth, it has been customized for STLC2592/2593/2500D Bluetooth transceivers. The BAL-2593D5U integrates a complex impedance matching network, so no external components are required on the PCB. Both overall performances and PCB area are optimized. More

Interconnection board brings MEMS modules and STM32 evaluation boards together

The STEVAL-MKI032V1 serves to connect data and control signals of a MEMS sensor demo board to the MCU pins on STM32 evaluation boards from ST or IAR. This interconnection board has a DIL24 socket that is compatible with several MEMS demo boards available from ST. Once plugged onto the MCU board, the system has full control over the MEMS sensor. For analog sensors, all axes, power-down and full-scale signals are available. For digital sensors, both SPI and I²C interfaces are usable as well as interrupt lines. A MEMS library and source code examples show how to acquire data from a sensor and send them to a PC over USB or how to display the data using an LCD. More

Low-loss 1200 V IGBT series reduce energy use in everyday motor drives

ST’s STGW30N120KD and STGW40N120KD are respectively 30 A and 40 A, 1200 V short-circuit rugged IGBTs. They achieve power savings using ST’s PowerMESH™ process, and deliver greater all-round energy efficiency. They are capable of surviving short circuits lasting up to 10 μs, making them resistant to common causes of motor-controller failures. They are available in the compact TO-247 package and integrate an ultra-fast freewheeling diode. More

600 V, 12 A SCR requires very low gate current

The TN1205T-600B was designed for applications where small areas and high current density are required. With its small IGT span (2 to 5 mA), it increases repeatability in the application as it is driven directly by a microcontroller through a simple resistor in series. This avoids the use of a gate driver, so simplifying the application and FMEA analysis, and limiting the component count. More

Demo video shows STM8L in action with various ultra-low-power sources

This entertaining 4-minute video clip shows a hand-held game incorporating ST's STM8L ultra-low-power MCU and an LCD display, running from various low-power sources: from a quick dynamo jolt, to RF induction, solar cells, a cactus, and even the heat from a cup of coffee. The STM8L uses a proprietary ultra-low leakage process to draw as little as 5.4 µA in low-power run mode, and 350 nA in halt mode. More

Online presentation shows how ST's MEMS gyroscopes work, their features and applications

This 20-minute online presentation describes how MEMS gyroscopes are developed and produced at ST, their main applications, their internal structure and working principles, and details on how to use them for your application. More

ARM Techcon3, Santa Clara, October 21 to 23, 2009

ARM Techcon3 expands its conference offering to focus on three key challenges of ARM development - MCU & Tools, Internet Everywhere and Energy Efficiency & Design. On October 21 at 10 am, ST will present the advantages of using a common processor architecture but also show what distinguishes ST MCUs from the other ARM-based MCUs on the market. More

Solar Power International, Anaheim, Californa, October 27 to 29

STMicroelectronics, the worldwide leader in power conversion, will present its latest solutions and products for photovoltaic applications at the Solar Power International 2009. Several inverter solutions and the products used will be presented. These include ST’s high-efficiency MDmesh V power MOSFETs, the ultra-low-power STM8L microcontroller family, MEMS and power line modems. More

Cartes 2009, Paris, France, November 17 to 19

Cartes is the world's premier event for Digital Security and Smart Technologies and other secure technologies. ST will demonstrate its large line-up of Smartcards, RFID, and Near-field communication solutions. Come visit us at booth 4 J 028. More

SPS/IPC/DRIVES 2009, Nuremberg, November 24 to 26, 2009

SPS/IPC/DRIVES is the exhibition for electric automation technology. It covers all system components and offers integrated automation solutions. A key player in the automation industry, ST will present advanced solutions in motion, energy efficiency, communication/identification and automation peripherals. Come visit us at Halle 6, booth 328. More