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STMicroelectronics and NXP unveil management team for joint venture
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| New company prepares to enter global market in Q3 2008 Geneva, Switzerland, and Eindhoven, The Netherlands – June 26, 2008 – NXP, the independent semiconductor company founded by Philips, and STMicroelectronics (NYSE:STM), a leader in delivering advanced solutions for mobile products, today announced that their new joint venture name will be ST-NXP Wireless. Created from the mobile and wireless businesses of STMicroelectronics and NXP, which together generated $3 billion USD in revenue in 2007, the new company will begin operations in a strong position to meet customer needs in 2G, 2.5G, 3G, multimedia, connectivity and all future wireless technologies. ST-NXP Wireless is expected to enter the market in number three position once full closure of the joint venture takes place, as scheduled, in the third quarter of 2008. It was also announced today that the management team of ST-NXP Wireless will comprise experienced industry leaders from both parent companies. Alain Dutheil, presently chief operating officer (COO) of STMicroelectronics, has been assigned to lead ST-NXP Wireless as Chief Executive Officer (CEO) focusing exclusively on the new joint venture. The Executive Committee of ST-NXP Wireless, led by Alain Dutheil, will include:
“The new name, ST-NXP Wireless, clearly illustrates the joining together of two complementary and formidable forces in the worldwide market to create a new global wireless powerhouse,” commented Alain Dutheil, designated CEO, ST-NXP Wireless. “Our new company will be uniquely positioned to continue and extend customer relationships with the key players in the mobile and wireless industry, leveraging the passion and expertise of what is one of the best pools of talents in the industry.” ST-NXP Wireless will be among the few companies with the scale to make the R&D investments necessary to deliver current and future wireless technologies. The joint-venture will combine key design, sales and marketing, and back-end manufacturing assets from both parent companies into a streamlined organisation that will rely on its parent companies and foundries for wafer fabrication services. ST-NXP Wireless will be headquartered in Switzerland. Aiming to close in Q3 2008, the deal is subject to regulatory approvals and labor council consultation. Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) based on management’s current views and assumptions and involve known and unknown risks and uncertainties that could cause actual results, performance or events to differ materially from those in such statements. About STMicroelectronics About NXP For further information, please contact: MEDIA RELATIONS:
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