Space saving single chip IPAD ® Audio connector in Flip Chip

The single chip solution

ST provides an advanced family of integrated passive and active devices that includes a breakthrough technology with high density capacitance integration on top of EMI filters and ESD protection. From dedicated devices to the new all-in-one EMIF06-AUD01F2, ST delivers the best in-class solutions ; where the stop-band attenuation is optimized for frequency bands ranging from 800 to 2480 MHz, due  to the integration of 4 x 1.3 nF capacitors on microphone lines.


EMIF06-AUD01F2 Internal Structure

Space Saving Package

The EMIF06-AUD01F2 is housed in a RoHS compliant, Flip Chip lead-free package, with a 500 µm pitch in a 5x 4 bump matrix. Since the die-size equals that of the package, the space consumption on a printed wired board for EMIF06-AUD01F2 is 4.65 mm². The equivalent space consumption using discrete components is 21 mm².

Very Low Clamping Voltage

The EMIF06-AUD01F2 is housed in a RoHS compliant, Flip Chip lead-free package, with a 500 µm pitch in a 5x 4 bump matrix. Since the die-size equals that of the package, the space consumption on a printed wired board for EMIF06-AUD01F2 is 4.65 mm². The equivalent space consumption using discrete components is 21 mm².

Targeted Applications

Electronic consumer goods with an audio headset connector, such as: Mobile phones Portable audio equipment