About ST
Products
Applications
Support
Buy
News & Events
ST Worldwide
Contact Us
Login
Datasheets
|
Transistors
|
IGBTs
|
600V
N-CHANNEL 10A 600V TO-220/FP/D2PAK SHORT CIRCUIT RATED PowerMESH IGBT
Datasheet
Format:
(529 kb)
or
(13 kb)
Last Updated: 14/05/2007
Pages: 17
Related Information
IGBTs Product Page
Related User Manuals
Motor drive reference design kit
Raw Ascii Text
- (
Hide
)
(Unformatted textual content of the document used by search engines)
STGB10NC60KD STGF10NC60KD - STGP10NC60KD
N-channel 600V - 10A - D2PAK / TO-220 / TO-220FP Shor t circuit rated PowerMESHTM IGBT
General features
Type STGB10NC60KD STGP10NC60KD STGF10NC60KD
VCES 600V 600V 600V
VCE(sat)Max @25C <2.5V <2.5V <2.5V
IC @100C 10A 10A 6A
3 1 2
1 3 2
TO-220
TO-220FP
Lower on voltage drop (Vcesat) Lower CRES / CIES ratio (no cross-conduction susceptibility) Very soft ultra fast recovery antiparallel diode Short circuit withstand time 10s
3 1
D²PAK
Description
Using the latest high voltage technology based on a patented strip layout, STMicroelectronics has designed an advanced family of IGBTs, the PowerMESHTM IGBTs, with outstanding performances. The suffix "K" identifies a family optimized for high frequency motor control applications with short circuit withstand capability.
Internal schematic diagram
Applications
High frequency motor controls SMPS and PFC in both hard switch and resonant topologies Motor drivers
Order codes
Part number STGB10NC60KDT4 STGP10NC60KD STGF10NC60KD Marking GB10NC60KD GP10NC60KD GF10NC60KD Package D²PAK TO-220 TO-220FP Packaging Tape & reel Tube Tube
February 2007
Rev 5
1/17
www.st.com 17
Contents
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
Contents
1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Electrical characteristics (curves) . . .. . .. . .. . .. . ..... 7
3 4 5 6
Test circuit
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2/17
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
Electrical ratings
1
Electrical ratings
Table 1.
Symbol VCES IC(1) IC(1) ICM(2) VGE IF PTOT VISO Tstg Tj Tscw Tl
Absolute maximum ratings
Value Parameter D²PAK/TO-220 TO-220FP Collector-emitter voltage (VGS = 0) Collector current (continuous) at TC = 25C Collector current (continuous) at TC = 100C Collector current (pulsed) Gate-emitter voltage Diode RMS forward current at Tc=25C Total dissipation at TC = 25C Insulation withstand voltage (RMS) from all three leads to external heat sink (t=1s;TC=25C) Storage temperature 55 to 150 Operating junction temperature Shor t circuit withstand time Maximum lead temperature for soldering purpose (for 10sec. 1.6 mm from case)
T T J ---- A --C I ( T ) = -----------------------------------------M------X----------------------------------------------CC R ×V (T , I ) THJ C CESAT(MAX) C C
Unit 600 20 10 30 20 10 60 -25 2500 9 6 V A A A V A W
C s C
10 300
1. Calculated according to the iterative formula:
2. Pulse width limited by max junction temperature
Table 2.
Symbol Rthj-case Rthj-amb
Thermal resistance
Parameter TO-220/D²PAK Thermal resistance junction-case Max TO-220FP Thermal resistance junction-ambient Max 5.0 62.5 C/W C/W Value 2.08 Unit C/W
3/17
Electrical characteristics
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
2
Electrical characteristics
(TCASE=25C unless otherwise specified) Table 3.
Symbol VBR(CES) VCE(sat) VGE(th) ICES IGES gfs
Static
Parameter Collector-emitter breakdown voltage Test conditions IC= 1mA, VGE= 0 Min. 600 2.2 1.8 4.5 2.5 Typ. Max. Unit V V V V A mA nA S
Collector-emitter saturation VGE= 15V, IC= 5A voltage VGE= 15V, IC= 5A, Tc= 125C Gate threshold voltage Collector cut-off current (VGE = 0) Gate-emitter leakage current (VCE = 0) Forward transconductance VCE= VGE, IC= 250 A VCE= Max rating,TC= 25C VCE=Max rating,TC= 125C VGE= 20V, VCE= 0 VCE = 15V, IC= 5A
6.5 150 1 100 15
Table 4.
Symbol Cies Coes Cres Qg Qge Qgc
Dynamic
Parameter Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate-emitter charge Gate-collector charge Test conditions VCE = 25V, f = 1MHz, VGE = 0 VCE = 390V, IC = 5A, VGE = 15V, (see Figure 18) Min. Typ. Max. 380 46 8.5 19 5 9 Unit pF pF pF nC nC nC
4/17
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
Electrical characteristics
Table 5.
Symbol td(on) tr (di/dt)on td(on) tr (di/dt)on tr(Voff) td(off) tf tr(Voff) td(off) tf
Switching on/off (inductive load)
Parameter Turn-on delay time Current rise time Turn-on current slope Test conditions VCC = 390V, IC = 5A , RG= 10 VGE= 15V, Tj= 25C (see Figure 19) VCC = 390V, IC = 5A , RG= 10 VGE= 15V, Tj=125C (see Figure 19) Vcc = 390V, IC = 5A, , RGE = 10 VGE = 15V,TJ=25C (see Figure 19) Vcc = 390V, IC = 5A, , RGE=10 VGE =15V, Tj=125C (see Figure 19) Min. Typ. 17 6 655 Max. Unit ns ns A/s
Turn-on delay time Current rise time Turn-on current slope
16.5 6.5 575
ns ns A/s
Off voltage rise time Turn-off delay time Current fall time
33 72 82
ns ns ns
Off voltage rise time Turn-off delay time Current fall time
60 106 136
ns ns ns
Table 6.
Symbol Eon(1) Eoff(2) Ets Eon(1) Eoff(2) Ets
Switching energy (inductive load)
Parameter Turn-on switching losses Turn-off switching losses Total switching losses Turn-on switching losses Turn-off switching losses Total switching losses Test conditions VCC = 390V, IC = 5A RG= 10 VGE=15V, Tj=25C , (see Figure 19) VCC = 390V, IC = 5A , RG= 10 VGE= 15V, Tj= 125C (see Figure 19) Min. Typ. 55 85 140 87 162 249 Max. Unit J J J J J J
1. Eon is the tun-on losses when a typical diode is used in the test circuit in figure 2. If the IGBT is offered in a package with a co-pak diode, the co-pack diode is used as external diode. IGBTs & Diode are at the same temperature (25C and 125C) 2. Turn-off losses include also the tail of the collector current
5/17
Electrical characteristics
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
Table 7.
Symbol Vf t rr Qrr I rr m t rr Qrr I rr m
Collector-emitter diode
Parameter Forward on-voltage Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current Test conditions If = 2.5A If = 2.5A, Tj = 125C If = 5A,VR = 30V, Tj = 25C, di/dt = 100 A/s (see Figure 20) If = 5A,VR = 30V, Tj =125C, di/dt = 100A/s (see Figure 20) Min. Typ. 1.6 1.3 23.5 16.5 1.4 39 39 2 Max. 2.1 Unit V V ns nC A ns nC A
6/17
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
Electrical characteristics
2.1
Figure 1.
Electrical characteristics (curves)
Output characteristics Figure 2. Transfer characteristics
Figure 3.
Transconductance
Figure 4.
Collector-emitter on voltage vs temperature
Figure 5.
Gate charge vs gate-source voltage Figure 6.
Capacitance variations
7/17
Electrical characteristics Figure 7.
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD Figure 8. Collector-emitter on voltage vs collector current
Normalized gate threshold voltage vs temperature
Figure 9.
Normalized breakdown voltage vs temperature
Figure 10. Switching losses vs temperature
Figure 11. Switching losses vs gate resistance Figure 12. Switching losses vs collector current
8/17
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD Figure 13. Thermal impedance for TO-220/ D²PAK
Electrical characteristics
Figure 14. Turn-off SOA
Figure 15. Emitter-collector diode characteristics
Figure 16. Thermal impedance for TO-220FP
9/17
Test circuit
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
3
Test circuit
Figure 18. Gate charge test circuit
Figure 17. Test circuit for inductive load switching
Figure 19. Switching waveform
Figure 20. Diode recovery time waveform
10/17
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
Package mechanical data
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
11/17
Package mechanical data
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
TO-220 MECHANICAL DATA
DIM. A b b1 c D E e e1 F H1 J1 L L1 L20 L30 mm. MIN. 4.40 0.61 1.15 0.49 15.25 10 2.40 4.95 1.23 6.20 2.40 13 3.50 16.40 28.90 3.75 2.65 3.85 2.95 0.147 0.104 TYP M AX. 4.60 0.88 1.70 0.70 15.75 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 MIN. 0.173 0.024 0.045 0.019 0.60 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 0.645 1.137 0.151 0.116 inch TYP. M AX . 0.181 0.034 0.066 0.027 0.620 0.409 0.106 0.202 0.052 0.256 0.107 0.551 0.154
øP
Q
12/17
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
Package mechanical data
D2PAK MECHANICAL DATA TO-247 MECHANICAL DATA
mm. DIM. MIN. A A1 A2 B B2 C C2 D D1 E E1 G L L2 L3 M R V2 0 4.88 15 1.27 1.4 2.4 0.4 4 10 8.5 5.28 15.85 1.4 1.75 3.2 0.192 0.590 0.050 0.055 0.094 0.015 4.4 2.49 0.03 0.7 1.14 0.45 1.23 8.95 8 10.4 0.393 0.334 0.208 0.625 0.055 0.068 0.126 T YP M AX. 4.6 2.69 0.23 0.93 1.7 0.6 1.36 9.35 MIN. 0.173 0.098 0.001 0.027 0.044 0.017 0.048 0.352 0.315 TYP. MAX. 0.181 0.106 0.009 0.036 0.067 0.023 0.053 0.368 inch
3
1
13/17
Package mechanical data
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
TO-220FP MECHANICAL DATA
mm. MIN. 4.4 2.5 2.5 0.45 0.75 1.15 1.15 4.95 2.4 10 16 28.6 9.8 2.9 15.9 9 3 30.6 10.6 3.6 16.4 9.3 3.2 1.126 .0385 0.114 0.626 0.354 0.118 TYP MAX. 4.6 2.7 2.75 0.7 1 1.7 1.7 5.2 2.7 10.4 MIN. 0.173 0.098 0.098 0.017 0.030 0.045 0.045 0.195 0.094 0.393 0.630 1.204 0.417 0.141 0.645 0.366 0.126 inch TYP. MAX. 0.181 0.106 0.108 0.027 0.039 0.067 0.067 0.204 0.106 0.409
DIM. A B D E F F1 F2 G G1 H L2 L3 L4 L5 L6 L7 Ø
A
B
L3 L6 L7
F1 F
D
G1 H
F2
L2 L5
E
123
L4
14/17
G
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
Packaging mechanical data
5
Packaging mechanical data
D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT
REEL MECHANICAL DATA
DIM. A B C D G N T 1. 5 12.8 20.2 24.4 100 30. 4 26. 4 13. 2 mm MIN. MAX . 330 0. 059 0.504 0.520 0795 0.960 1.039 3. 937 1.197 BULK QTY 1000 i n ch MIN. MAX. 12. 992
TAPE MECHANICAL DATA
DIM. A0 B0 D D1 E F K0 P0 P1 P2 R T W mm MI N. 10. 5 15. 7 1.5 1. 59 1. 65 11.4 4.8 3.9 11.9 1.9 50 0. 25 23. 7 24.3 MAX. 10.7 15.9 1. 6 1.61 1.85 11.6 5. 0 4. 1 12.1 2. 1 i n ch MI N. MAX. 0.413 0.421 0.618 0.626 0.059 0.063 0.062 0.063 0.065 0.073 0.449 0.456 0.189 0.197 0.153 0.161 0.468 0.476 0.075 0.082 1.574 0.35 0.0098 0.0137 0.933 0.956
BASE QTY 1000
* on sales type
15/17
Revision history
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
6
Revision history
Table 8.
Date 14-Jun-2005 19-Jul-2005 27-Jan-2006 01-Mar-2006 08-Feb-2007
Revision history
Revision 1 2 3 4 5 New release Complete version Inser ted ecopack indication The document has been reformatted Modified value on Table 5.: Switching on/off (inductive load) Changes
16/17
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
17/17
Document Number: 11423
Untitled Document
Further Information
Contact
Online Support
(Registration Required)
(529 kb)
